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 SoC Packaging Engineer - Cupertino, California, United States

   
Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Components
 
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
 
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200001004 / Latpro-3738546 
Date posted: Apr-22-2020
State, Zip: California, 95014

Description

SoC Packaging Engineer

Santa Clara Valley (Cupertino) , California , United States

Hardware

Summary

Posted: Feb 11, 2019

Role Number: 200001004

Seeking an innovative individual to take on Packaging integration and process development role for a variety of projects including SoC.

Key Qualifications

  • 5+ years experience in Semiconductor Packaging Process, Design and Material development.
  • Expert in packaging assembly processes including SMT, die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation and back-end processes.
  • Expert in materials characterization and analysis, DOE, reliability standards and FA techniques.
  • Excellent communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers.
  • Ability to work independently and take on projects with minimum supervision.
  • Excellent engineering problem solving with strong physics and fundamentals.
  • Familiar with package design software, APD, etc.
  • Working knowledge in memory device architecture, design, test, etc.
  • Strong program management skills

Description

  • Responsible leading packaging assembly technology development.
  • Work with cross functional team and lead SoC Package integration and architecture efforts.
  • Work with foundry and OSAT to bring packaging solution from concept to HVM.
  • Drive industry with advanced Package solutions, new material development, and specs. 
  • 5 % International travel.

    Education & Experience

  • Ph.D. or M.S. in Chemical Engineering, Materials Science, Mechanical Engineering, or Physics.



  • Requirements

    See job description

     

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