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 Chip Level PD CAD Flow and Methodology Engineer - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Components
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200002746 / Latpro-3738570 
Date posted: Apr-22-2020
State, Zip: California, 95014


Chip Level PD CAD Flow and Methodology Engineer

Santa Clara Valley (Cupertino) , California , United States



Posted: Apr 17, 2020

Role Number: 200002746

Do you love creating elegant solutions to highly complex challenges? Do you intrinsically see the importance in every detail? As part of our Silicon Technologies group, you'll help design and manufacture our next-generation, high-performance, power-efficient processor, system-on-chip (SoC). You'll ensure Apple products and services can seamlessly and efficiently handle the tasks that make them beloved by millions. Joining this group means you'll be responsible for crafting and building the technology that fuels Apple's devices. Together, you and your team will enable our customers to do all the things they love with their devices. In this role, you will develop and support the top-level place and route methodology and flow. This flow is used by multiple projects at multiple sites. You will collaborate with physical design teams, CAD team, and EDA vendors.

Key Qualifications

  • 15+ years experience in hierarchical ASIC P&R and flow development.
  • Experience with all aspects of ASIC PD including floorplanning, power-distribution, multi-voltage design, pad ring construction, placement, CTS, and routing.
  • Understanding of hierarchical P&R issues including top-level floorplanning, pin- assignment, clock-distribution, critical-signal handling, UPF, MVRC, hierarchical abstractions (black-box, ILM, etc.), and dealing with pad-ring logic/IP.
  • Strong TCL/Perl/Makefile scripting knowledge and experience developing complex algorithms, managing, and regressing P&R flows.
  • Familiarity with chip-finishing issues (metal-fill, spare-cells, DFM rules, boundary-cells, etc.) for the latest generations of process technologies.
  • We are looking for a self-motivated, proactive problem solver. Strong interpersonal and communication skills are required.
  • ICC or Encounter knowledge is a plus.
  • Technical leadership experience is helpful


We are seeking an engineer to join our team to: We are seeking an engineer to join our team to: - Provide innovative solutions to improve quality of physical design. - Work with chip design teams to implement and customize design flows that are optimal for a given chip. - Provide documentation, training and new-user-support. - Responsible for the diagnosis, resolution, and regression of reported problems for multiple projects/sites. - Work with CAD teams to integrate the flow into the larger infrastructure.

Education & Experience

BS/MS in EE/CS or equivalent


See job description


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