Spanish bilingual and Hispanic jobs since 1997. Diversity job fairs since 2006. employers     login   |   register - post a job
Hispanic Diversity Recruitment - best jobs for hispanic, latino & bilingual (spanish & portuguese) jobseekers
    Log me in!   |   Site Map   |   Help   
 IC Packaging Integration Engineer - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Software Engineer
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200170423 / Latpro-3741336 
Date posted: May-15-2020
State, Zip: California, 95014


IC Packaging Integration Engineer

Santa Clara Valley (Cupertino) , California , United States



Posted: May 13, 2020

Role Number: 200170423

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, talented and passionate IC Packaging Engineer to join our team.

Key Qualifications

  • 5+ years experience in semiconductor packaging and/or system integration
  • Good understanding of cross-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration
  • Expertise in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
  • Excellent problem solving with strong physics and fundamentals
  • Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
  • Basic knowledge of signal integrity / power integrity


You will be responsible for IC packaging development Work with cross functional team and lead SoC Package integration and architecture efforts Drive industry with advanced package solutions, new material developments, and specs

Education & Experience

Ph.D. or M.S. in Mechanical, Materials Science, Chemical, or Electrical Engineering


See job description


Apple requires you to fill in their on-line form which will open in a different window.

Enter your email address and click 'Apply':
  Prefer not to enter your email?