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 Assembly Integration Engineer - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Software Engineer
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200201532 / Latpro-3759179 
Date posted: Oct-23-2020
State, Zip: California, 95014


Assembly Integration Engineer

Santa Clara Valley (Cupertino) , California , United States



Posted: Oct 22, 2020

Role Number: 200201532

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Engineer to join our team. In this highly visible role, you will develop advanced packaging technologies, define assembly baseline processes, decide package BOM, establish package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.

Key Qualifications

  • 5+ years of extensive experience in Semiconductor Packaging field.
  • Working knowledge in materials characterization and analysis
  • Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
  • General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
  • Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
  • Ability to work independently and take on projects with minimum supervision.
  • Good engineering problem solving skills with strong engineering physics and fundamentals.
  • Can use package design softwares, APD, Virtuoso, etc.
  • Working knowledge in memory packaging.
  • Good program management skill


Responsible to lead packaging technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. 5% International travel.

Education & Experience

M.S. or PhD in Materials Science, Mechanical Engineering or an equivalent field desired.


See job description


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