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 Packaging Substrate Engineer - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Software Engineer
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200201570 / Latpro-3759273 
Date posted: Oct-23-2020
State, Zip: California, 95014


Packaging Substrate Engineer

Santa Clara Valley (Cupertino) , California , United States



Posted: Oct 23, 2020

Role Number: 200201570

Are you excited for opportunity to develop a company's technological backbone from ground up? We're looking for an applicant have a creative mindset to find & drive innovative solutions to support our industry-leading product & bring ideas to live. The ideal candidate should have hands on experience in substrate industry for technology development & program management.

Key Qualifications

  • 5+ years of experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology
  • Familiar with PKG process & criteria is preferred.
  • Exceptional technology development & project management skills
  • Strong communication & collaborative skills


  • Responsible for substrate technology path finding and roadmap execution
  • Direct interface with vendors for new package development and qualification
  • Drive vendors to meet requirement & timeline
  • Work across variety of functional groups directly & involve in engineering, product development

    Education & Experience

  • BS/BA above w/ 5+ years relevant work experience

  • Requirements

    See job description


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