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 SoC Thermal Engineer - Cupertino, California, United States

   
Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Software Engineer
 
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
 
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200201442 / Latpro-3759875 
Date posted: Oct-28-2020
State, Zip: California, 95014

Description

SoC Thermal Engineer

Santa Clara Valley (Cupertino) , California , United States

Hardware

Summary

Posted: Oct 27, 2020

Role Number: 200201442

Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.

Key Qualifications

  • Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices.
  • Experience in modeling transient thermal response and reduced-order modeling in mobile devices.
  • Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
  • Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
  • Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
  • Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
  • Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk etc.
  • Ability to drive and lead cross-functional teams to execute on "design for thermal".

Description

This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance Developing detailed and reduced-order thermal models Analyzing simulation and measurement results to enhance product thermal management

Education & Experience

MS or PhD in an Engineering Discipline, related field or experience in lieu of



Requirements

See job description

 

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