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 IC Packaging Simulation Engineer - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Computers - Software Engineer
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200201543 / Latpro-3760137 
Date posted: Oct-30-2020
State, Zip: California, 95014


IC Packaging Simulation Engineer

Santa Clara Valley (Cupertino) , California , United States



Posted: Oct 29, 2020

Role Number: 200201543

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary results? We are looking for a self-motivated individual who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. The individual should also be an expert programmer of numerical simulation tools, such as Matlab and/or Python.

Key Qualifications

  • Solid training in mechanics and mathematics.
  • Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
  • Familiar with numerical simulation software tools. Expert programmer of Matlab and/or Scientific Python.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
  • Able to perform independent research and development work
  • Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings


You will work on:

  • Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
  • Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.

    Education & Experience

  • PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.

  • Requirements

    See job description


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