Description |
Advisory Signal Integrity Engineer, IBM Corporation, Austin, TX: Develop CPU-GPU links running up to 50Gb/s and CPU to memory buffer links running up to 32Gb/s. Conduct Electromagnetic modelling of high speed bus waveguiding components. Conduct Time domain eye simulation oh high speed communication buses including transmitter and receiver circuitry and the passive interconnect. Create and ensure computer board layout guidelines to achieve good signal integrity. Responsible for high speed bus design lab validation. Research and develop ultra-high speed communication buses which requires a move from copper based transmission line technology, microstrip, and stripline and moving to concepts such as quasi-optical dielectic ribbon waveguides, electro-optics modules, and different signaling schemes capable of achieving speeds up to 200Gb/s. Utilize 3D Finite Element Electromagnetic Modelling; Time Domain Simulations; Programming and Data Analysis; Radio Frequency (RF), Microwave and High speed Link Testing; Board Layout Design; Operating Systems Windows and Linux; and Real Time embedded systems applications. Required: Master's degree or equivalent in Communications Engineering or related and one (1) year of experience as a Research Assistant, Engineer, or related. One (1) year of experience must include utilizing 3D Finite Element Electromagnetic Modelling; Time Domain Simulations; Programming and Data Analysis; RF, Microwave and High speed Link Testing; Board Layout Design; Operating Systems Windows and Linux; and Real Time embedded systems applications. Send resumes to recruitad@us.ibm.com. Applicants must reference Y193a.
recblid wr374pb8adqxfqqd1vdj1m6ngo7bd3

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Requirements |
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