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 Engineer - Los Angeles, California, United States

   
Job information
Posted by: Confidential 
Hiring entity type: Other 
Work authorization: Existing work authorization required for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Engineering - Other
 
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
 
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: XheIz82WChKWfNGLYljPwX1vuD4QFG / Latpro-3796807 
Date posted: Jun-04-2021
State, Zip: California, 90010

Description

Engineer: El Segundo - Infineon Technologies Americas Corp is seeking Packaging Engineer to provide technical support for semiconductor mfg line and packaging eng. Req's Bach degree or foreign equiv. in Electronics Eng or rltd fld and 4 yrs of rltd industry exp. Must have exp in the following processes: Wafer Dicing, Die attach (soft solder, solder paste, solder and mold voids), Plasma, Wire Bonding, Molding, X-ray, Trimming, curing ovens, Forming, and Laser marking. Must have exp with the following products: all FETS and IGBTS. Must have exp with the following equip: ESEC 3088, conventional molding, DAD 341, Plasma etch cleaners, Dispatch Oven, Gold wire bonder (any machine), OE M360C, OE 20B, Reflow conveyor, Shear & Pull tester (Condor sigma), Powatec wafer mounting, and laminators. Employer will accept 2 yrs of exp in lieu of each yr of study not completed toward the required Bach degree. Will accept any suitable comb of education, training, or exp. Up to 5% of dom and int'l travel required. Send resume w/ job code LAT035 to: Staffing Department, Infineon Technologies, 101 N. Pacific Coast Highway, El Segundo, CA 90245
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