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 Hardware Technology - Integrated Circuit Packaging Intern - Cupertino, California, United States

Job information
Posted by: Apple 
Hiring entity type: Retail 
Work authorization: Not Specified for United States
Position type: Direct Hire, Full-Time 
Compensation: ******
Benefits: See below
Relocation: Not specified 
Position functions: Other
Travel: Unspecified 
Accept candidates: from anywhere 
Languages: English - Fluent
Minimum education: See below 
Minimum years experience: See below 
Resumes accepted in: English
Cover letter: No cover letter requested
Job code: 200279869 / Latpro-3822337 
Date posted: Sep-09-2021
State, Zip: California, 95014


Hardware Technology - Integrated Circuit Packaging Intern

Santa Clara Valley (Cupertino) , California , United States



Posted: Sep 9, 2021

Weekly Hours: 40

Role Number: 200279869

Home Office: Yes

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product. Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple's customers every single day. Integrated Circuit (IC) is the brain of modern electronics. IC Packages are the mechanical and electrical interfaces of ICs and the environment. IC Packaging is truly a challenging multidisciplinary field that attracts some of the top talents in the industry. As an IC Packaging Intern in Apple, you will work on characterizing IC packages and simulating package deformation and stress under different testing conditions. You will also be involved in developing characterization methodologies of materials used in IC packaging and automating model generation for stress simulation.

Key Qualifications

  • The role includes the following main duties:
  • Simulating deformation and stress of IC packages under various testing conditions.
  • Developing methodologies of automating FEM model generation.
  • Characterizing IC packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing, etc.
  • Characterizing key packaging materials, such as solders, polymers, etc.
  • Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test.


Required Experience: In a program of BS, MS, or PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields. Solid training in solid mechanics, mathematics, computer programing. Hands-on experience of major Finite Element Method tools (e.g., ANSYS or ABAQUS) and numerical simulation tools (e.g., Matlab or scientific Python). Preferred Experience: Previous experience with IC packaging Experience working with data acquisition system design (both hardware and software) Hands-on experience of major mechanical design CAD tools (e.g., NX, AutoCAD, SpaceClaim, or SolidWorks)

Education & Experience

In a program of BS, MS, or PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.


See job description


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